Invention Grant
- Patent Title: Temperature uniformity measurement during thermal processing
- Patent Title (中): 热处理期间的温度均匀性测量
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Application No.: US12273842Application Date: 2008-11-19
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Publication No.: US08109669B2Publication Date: 2012-02-07
- Inventor: Wolfgang Aderhold , Jallepally Ravi , Balasubramanian Ramachandran , Aaron M. Hunter , Ilias Iliopoulos
- Applicant: Wolfgang Aderhold , Jallepally Ravi , Balasubramanian Ramachandran , Aaron M. Hunter , Ilias Iliopoulos
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Diehl Servilla LLC
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L21/324
Abstract:
Methods and systems for determining a radial differential metrology profile of a substrate heated in a process chamber is provided. Methods and systems for determining an angular or azimuthal differential metrology profile of a rotating substrate in a processing chamber are also provided. The radial and azimuthal differential metrology profiles are applied to adjust a reference metrology profile to provide a Virtual metrology of the process chamber. The virtual metrology is applied to control the performance of the process chamber.
Public/Granted literature
- US20100124249A1 TEMPERATURE UNIFORMITY MEASUREMENT DURING THERMAL PROCESSING Public/Granted day:2010-05-20
Information query
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