Invention Grant
- Patent Title: Floor pump
- Patent Title (中): 落地泵
-
Application No.: US12356580Application Date: 2009-01-21
-
Publication No.: US08109745B2Publication Date: 2012-02-07
- Inventor: Scott Wu
- Applicant: Scott Wu
- Agency: Kamrath IP Lawfirm, PA
- Agent Alan Kamrath
- Main IPC: F04B53/12
- IPC: F04B53/12

Abstract:
A floor pump includes a base; and a cylinder assembly having a first end coupled to the base and a second end, with a cross-sectional area of the first end of the cylinder assembly being larger than the second end of the cylinder assembly. A linkage assembly is partially disposed in the cylinder assembly and communicates with the base. A hose has a first end coupled to the base and communicating with the linkage assembly and a second end coupled to a thing desired to be inflated.
Public/Granted literature
- US20100180957A1 Floor Pump Public/Granted day:2010-07-22
Information query