Invention Grant
- Patent Title: Imprint device and microstructure transfer method
- Patent Title (中): 压印装置和微结构转印方法
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Application No.: US11774244Application Date: 2007-07-06
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Publication No.: US08109751B2Publication Date: 2012-02-07
- Inventor: Takashi Ando , Susumu Komoriya , Masahiko Ogino , Akihiro Miyauchi
- Applicant: Takashi Ando , Susumu Komoriya , Masahiko Ogino , Akihiro Miyauchi
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2006-187958 20060707
- Main IPC: B28B11/08
- IPC: B28B11/08

Abstract:
There is provided an imprint device for transferring a fine pattern to a material to form a patterned material. The device comprises a stamper having the fine pattern thereon, and a pressure distribution mechanism. The stamper is pressed against the material, and the pressure distribution mechanism provides a nonuniform pressure distribution in a patterned region of the patterned material, while the stamper is in contact with the material. There are provided an imprint device and a microstructure transfer method, by which it is possible to sufficiently spread a resin or other material for forming a pattern layer between a stamper and a patterned material with a lower pressure so as not to damage the stamper or the patterned material, and to form a pattern formation layer having the uniform thickness on the patterned material.
Public/Granted literature
- US20080042319A1 IMPRINT DEVICE AND MICROSTRUCTURE TRANSFER METHOD Public/Granted day:2008-02-21
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