Invention Grant
- Patent Title: Method and system for double-sided patterning of substrates
- Patent Title (中): 用于基板双面图案化的方法和系统
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Application No.: US12686732Application Date: 2010-01-13
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Publication No.: US08109754B2Publication Date: 2012-02-07
- Inventor: Byung-Jin Choi , Sidlgata V. Sreenivasan
- Applicant: Byung-Jin Choi , Sidlgata V. Sreenivasan
- Applicant Address: US TX Austin
- Assignee: Molecular Imprints, Inc.
- Current Assignee: Molecular Imprints, Inc.
- Current Assignee Address: US TX Austin
- Agent Cameron A. King
- Main IPC: B29C59/00
- IPC: B29C59/00
Abstract:
A system of patterning first and second opposed sides of a substrate is described. The system may employ a mold assembly and obtaining a desired spatial relationship between the first and second opposed sides of the substrate and the mold assembly. In a further embodiment, the method and system may employ a first and a second mold assembly.
Public/Granted literature
- US20100129486A1 Method and System for Double-Sided Patterning of Substrates Public/Granted day:2010-05-27
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