Micromachined flex interposers and methods of making the same are provided herein. More specifically the teachings herein are directed to interposer pins and strips having a rigid substrate supporting upper and lower cantilevered ends having a polyimide layer and a metal layer configured to flex towards the substrate layer during connection with upper and lower contact pads. Additional layers of polyimide and metal can be added to affect the flexibility and robustness of the pins and strips herein.