Invention Grant
- Patent Title: Antero-lateral plating systems and methods for spinal stabilization
- Patent Title (中): 横向电镀系统和脊柱稳定的方法
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Application No.: US12660223Application Date: 2010-02-23
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Publication No.: US08109980B2Publication Date: 2012-02-07
- Inventor: Anthony J. Melkent
- Applicant: Anthony J. Melkent
- Applicant Address: CH Neuchatel
- Assignee: Kyphon Sarl
- Current Assignee: Kyphon Sarl
- Current Assignee Address: CH Neuchatel
- Main IPC: A61B17/80
- IPC: A61B17/80
Abstract:
A plating system for stabilization of a bony segment includes a plate engageable to at least first and second bony elements. For spinal stabilization, the plate is attached to the antero-lateral portions of at least first and second vertebrae and is structured to facilitate engagement of the plate to the vertebrae from an approach extending in the anterior-posterior directions.
Public/Granted literature
- US20100160966A1 Antero-lateral plating systems and methods for spinal stabilization Public/Granted day:2010-06-24
Information query
