Invention Grant
- Patent Title: Substrate processing apparatus and temperature control device
- Patent Title (中): 基板加工装置及温度控制装置
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Application No.: US10548320Application Date: 2004-03-05
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Publication No.: US08110044B2Publication Date: 2012-02-07
- Inventor: Toshihisa Nozawa , Koji Kotani
- Applicant: Toshihisa Nozawa , Koji Kotani
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Crowell & Moring LLP
- Priority: JP2003-061607 20030307
- International Application: PCT/JP2004/002815 WO 20040305
- International Announcement: WO2004/079805 WO 20040916
- Main IPC: H01L21/205
- IPC: H01L21/205

Abstract:
A first flow passage (16), which cools a temperature controlled object by a circulating first cooling water (15), and a second flow passage (19) separate from the first flow passage are provided so as to exchange heat between a second cooling water (18) flowing through the second flow passage (19) and the first cooling water (15). There is no need to store the first cooling water (15) in a tank of a constant capacity, and the first cooling water (15) flowing through the first flow passage (16) of a chiller corresponding part is absorbed substantially in its entirety by the second cooling water (18). A response becomes quick with respect to a load fluctuation of the temperature controlled object, and waste of energy can be reduced while improving accuracy of temperature control.
Public/Granted literature
- US20070272155A1 Substrate Processing Apparatus and Temperature Control Device Public/Granted day:2007-11-29
Information query
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