An adhesive composition comprising (A) an epoxy resin, (B) a curing agent, (C) a curing promoter, (D) an inorganic filler, (E) particles of a thermoplastic resin which is solid at 25° C., and (F) silicone powder having a particle size at cumulative 50% (d50), measured by a laser light diffraction method, of from 1 to 50 μm. The composition is particularly suitable to be applied by screen printing on a substrate or a silicon wafer.