A substrate supporting device for forming a coating film having a maximally even and necessary thickness with a sufficiently strong adhesiveness and a good film quality on a substrate, and a sputtering apparatus including such a substrate supporting device. The substrate supporting device for supporting a substrate on which a coating film is formed by sputtering is disposed in a vacuum chamber so as to be opposed to a sputtering target. The substrate supporting device is rotatable around a first rotation axis by a first driving mechanism and is rotatable around a second rotation axis by a second driving mechanism.