Invention Grant
- Patent Title: Assisted deposition, narrow trench damascene process for manufacturing a write pole of a magnetic write head
- Patent Title (中): 辅助沉积,窄沟槽镶嵌工艺,用于制造磁头写磁头
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Application No.: US12345828Application Date: 2008-12-30
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Publication No.: US08110085B2Publication Date: 2012-02-07
- Inventor: Wen-Chien David Hsiao , Yinshi Liu , Yi Zheng
- Applicant: Wen-Chien David Hsiao , Yinshi Liu , Yi Zheng
- Applicant Address: NL Amsterdam
- Assignee: Hitachi Global Storage Technologies Netherlands B.V.
- Current Assignee: Hitachi Global Storage Technologies Netherlands B.V.
- Current Assignee Address: NL Amsterdam
- Agency: Zilka-Kotab, PC
- Main IPC: C25D5/02
- IPC: C25D5/02 ; G11B5/127 ; H04R31/00

Abstract:
A method for forming a magnetic write head using a damascene process that does not form voids in the magnetic structure. An opening is formed in an alumina layer, the opening being configured to define a trench. Then a first layer of magnetic material is deposited into the trench. A CMP process is then performed to remove any voids that have formed in the first magnetic layer. Then a second layer of magnetic material is deposited over the first layer of magnetic material. In another embodiment of the invention, a opening is formed in the alumina layer, and a first layer of magnetic material is electroplated into the opening. A thin layer of non-magnetic material is then deposited, and a second layer of magnetic material is deposited over the thin layer of non-magnetic material. The thin layer of alumina advantageously provides a laminate structure that avoids data erasure.
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