Invention Grant
- Patent Title: Composite material for electric/electronic part, production method thereof, and electric/electronic part
- Patent Title (中): 电气电子部件用复合材料及其制造方法以及电气电子部件
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Application No.: US12977136Application Date: 2010-12-23
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Publication No.: US08110291B2Publication Date: 2012-02-07
- Inventor: Akira Tachibana , Chikahito Sugahara , Shuichi Kitagawa
- Applicant: Akira Tachibana , Chikahito Sugahara , Shuichi Kitagawa
- Applicant Address: JP Tokyo
- Assignee: The Furukawa Electric Co., Ltd.
- Current Assignee: The Furukawa Electric Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2008-165138 20080624
- Main IPC: H05K9/00
- IPC: H05K9/00
Abstract:
A composite material for an electric/electronic part, having a metal base, a resin film on at least a part of the metal base, and a layer of Sn or a Sn alloy on at least a part of the metal base at a site where the resin film is not provided, the layer of Sn or a Sn alloy including a solidified structure, and the resin film having a residual solvent quantity adjusted to 5% to 25% by mass.
Public/Granted literature
- US20110091738A1 COMPOSITE MATERIAL FOR ELECTRIC/ELECTRONIC PART, PRODUCTION METHOD THEREOF, AND ELECTRIC/ELECTRONIC PART Public/Granted day:2011-04-21
Information query
