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US08110423B2 Method of manufacturing semiconductor light-emitting device 有权
制造半导体发光器件的方法

Method of manufacturing semiconductor light-emitting device
Abstract:
A method of manufacturing a semiconductor light-emitting device which includes the steps of forming a plurality of light-emitting device sections (40), having an approximately rectangular shape in plan view, on a substrate (10) in a matrix shape, forming a first dividing groove (61) between the long sides (41) of the light-emitting device sections (40) so that the long side (41) of the light-emitting device section (40) is along an easily cleaved plane of the substrate (10), forming a second dividing groove (62), having a larger width than the width of the first dividing groove (61), between short sides (42) of the light-emitting device sections (40), and dividing the substrate (10) along a first dividing groove (61) and a second dividing groove (62) to cut out the light-emitting device section (40).
Abstract(Chinese):

一种制造半导体发光器件的方法，包括以下步骤：在矩阵形状的基板（10）上形成具有大致矩形形状的平面图的多个发光元件部（40），形成 在发光元件部分（40）的长边（41）之间的第一分隔槽（61），使得发光器件部分（40）的长边（41）沿着基板的易于切割的平面 （10），在所述发光元件部（40）的短边（42）之间形成具有比所述第一分割槽（61）的宽度大的宽度的第二分割槽（62），并分割所述基板 （10）沿着第一分隔槽（61）和第二分隔槽（62）切割出所述发光装置部分（40）。

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