Invention Grant
- Patent Title: Method for attaching a semiconductor chip in a plastic encapsulant, optoelectronic semiconductor component and method for the production thereof
- Patent Title (中): 用于将半导体芯片附着在塑料密封剂中的方法，光电子半导体部件及其制造方法
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Application No.: US10514461Application Date: 2003-05-14
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Publication No.: US08110437B2Publication Date: 2012-02-07
- Inventor: Gunter Waitl , Georg Bogner , Michael Hiegler , Matthias Winter
- Applicant: Gunter Waitl , Georg Bogner , Michael Hiegler , Matthias Winter
- Applicant Address: DE Regensburg
- Assignee: Osram Opto Semiconductors GmbH
- Current Assignee: Osram Opto Semiconductors GmbH
- Current Assignee Address: DE Regensburg
- Agency: Fish & Richardson P.C.
- Priority: DE10221857 20020516
- International Application: PCT/DE03/01557 WO 20030514
- International Announcement: WO03/098706 WO 20031127
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A radiation-emitting or -receiving semiconductor chip 9 is soft-soldered for mounting on a leadframe 2 over which a prefabricated plastic encapsulant 5, a so-called premolded package, is injection-molded. Through the use of a low-melting solder 3 applied in a layer thickness of less than 10 μm, the soldering process can be carried out largely without thermal damage to the plastic encapsulant 5.
Public/Granted literature
- US20050214968A1 Method for fixing a semiconductor chip in a plastic housing body, optoelectronic semiconductor component Public/Granted day:2005-09-29
Information query
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