Invention Grant
US08110446B2 Method of making a semiconductor chip assembly with a post/base heat spreader and a conductive trace
有权
制造具有柱/基散热器和导电迹线的半导体芯片组件的方法
- Patent Title: Method of making a semiconductor chip assembly with a post/base heat spreader and a conductive trace
- Patent Title (中): 制造具有柱/基散热器和导电迹线的半导体芯片组件的方法
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Application No.: US12617725Application Date: 2009-11-13
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Publication No.: US08110446B2Publication Date: 2012-02-07
- Inventor: Charles W. C. Lin , Chia-Chung Wang
- Applicant: Charles W. C. Lin , Chia-Chung Wang
- Applicant Address: TW Taipei
- Assignee: Bridge Semiconductor Corporation
- Current Assignee: Bridge Semiconductor Corporation
- Current Assignee Address: TW Taipei
- Agent David M. Sigmond
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the post with an aperture in the conductive layer, then flowing the adhesive into and upward in a gap located in the aperture between the post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.
Public/Granted literature
- US20100055812A1 METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEAT SPREADER AND A CONDUCTIVE TRACE Public/Granted day:2010-03-04
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