Invention Grant
- Patent Title: Graded dielectric layers
- Patent Title (中): 梯度介电层
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Application No.: US11216542Application Date: 2005-08-30
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Publication No.: US08110469B2Publication Date: 2012-02-07
- Inventor: Dan Gealy , Vishwanath Bhat , Cancheepuram V. Srividya , M. Noel Rocklein
- Applicant: Dan Gealy , Vishwanath Bhat , Cancheepuram V. Srividya , M. Noel Rocklein
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Schwegman, Lundberg & Woessner, P.A.
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L21/3205 ; H01L21/31 ; H01L21/469

Abstract:
Graded dielectric layers and methods of fabricating such dielectric layers provide dielectrics in a variety of electronic structures for use in a wide range of electronic devices and systems. In an embodiment, a dielectric layer is graded with respect to a doping profile across the dielectric layer. In an embodiment, a dielectric layer is graded with respect to a crystalline structure profile across the dielectric layer. In an embodiment, a dielectric layer is formed by atomic layer deposition incorporating sequencing techniques to generate a doped dielectric material.
Public/Granted literature
- US20070048953A1 Graded dielectric layers Public/Granted day:2007-03-01
Information query
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