Method of making micromodules including integrated thin film inductors

Invention Grant

US08110474B2 Method of making micromodules including integrated thin film inductors 有权

Title translation: 制造微型模块的方法，包括集成薄膜电感器

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Patent Title: Method of making micromodules including integrated thin film inductors
Patent Title (中): 制造微型模块的方法，包括集成薄膜电感器
Application No.: US12906955

Application Date: 2010-10-18
Publication No.: US08110474B2

Publication Date: 2012-02-07
Inventor: Francesco Carobolante , Douglas Alan Hawks
Applicant: Francesco Carobolante , Douglas Alan Hawks
Applicant Address: US ME South Portland
Assignee: Fairchild Semiconductor Corporation
Current Assignee: Fairchild Semiconductor Corporation
Current Assignee Address: US ME South Portland
Agency: Kilpatrick Townsend & Stockton LLP
Main IPC: H01L21/20
IPC: H01L21/20

Method of making micromodules including integrated thin film inductors

Abstract:

Micromodules and methods of making them are disclosed. An exemplary micromodule includes a substrate having a thin film inductor, and a bumped die mounted on the substrate and over the thin film inductor.

Abstract(Chinese):

公开了微型组件及其制造方法。示例性的微型组件包括具有薄膜电感器的衬底和安装在衬底上并在薄膜电感器上的凸起裸片。

Public/Granted literature

US20110030206A1 MICROMODULES INCLUDING INTEGRATED THIN FILM INDUCTORS AND METHODS OF MAKING THE SAME Public/Granted day:2011-02-10

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/02	.半导体器件或其部件的制造或处理
H01L21/04	..至少具有一个跃变势垒或表面势垒的器件，例如PN结、耗尽层、载体集结层
H01L21/18	...器件有由周期表Ⅳ族元素或含有/不含有杂质的AⅢBⅤ族化合物构成的半导体，如掺杂材料
H01L21/20	....半导体材料在基片上的沉积，例如外延生长