Invention Grant
US08110485B2 Nanocrystal silicon layer structures formed using plasma deposition technique, methods of forming the same, nonvolatile memory devices having the nanocrystal silicon layer structures, and methods of fabricating the nonvolatile memory devices
有权
使用等离子体沉积技术形成的纳米晶硅层结构,其形成方法,具有纳米晶硅层结构的非易失性存储器件以及制造非易失性存储器件的方法
- Patent Title: Nanocrystal silicon layer structures formed using plasma deposition technique, methods of forming the same, nonvolatile memory devices having the nanocrystal silicon layer structures, and methods of fabricating the nonvolatile memory devices
- Patent Title (中): 使用等离子体沉积技术形成的纳米晶硅层结构,其形成方法,具有纳米晶硅层结构的非易失性存储器件以及制造非易失性存储器件的方法
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Application No.: US12388846Application Date: 2009-02-19
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Publication No.: US08110485B2Publication Date: 2012-02-07
- Inventor: Jun sin Yi , Byoung deog Choi , Sung wook Jung , Kyung soo Jang , Jae hyun Cho
- Applicant: Jun sin Yi , Byoung deog Choi , Sung wook Jung , Kyung soo Jang , Jae hyun Cho
- Applicant Address: KR
- Assignee: Sungkyunkwan University Foundation for Corporate Collaboration
- Current Assignee: Sungkyunkwan University Foundation for Corporate Collaboration
- Current Assignee Address: KR
- Agency: Camoriano and Associates
- Agent Theresa Fritz Camoriano
- Priority: KR10-2008-0128316 20081217
- Main IPC: H01L21/36
- IPC: H01L21/36 ; H01L29/76

Abstract:
Provided are nanocrystal silicon layer structures formed using a plasma deposition technique, methods of forming the same, nonvolatile memory devices including the nanocrystal silicon layer structures, and methods of fabricating the nonvolatile memory devices. A method of forming a nanocrystal silicon layer structure includes forming a buffer layer on a substrate and forming a nanocrystal silicon layer on the buffer layer by a plasma deposition technique using silicon (Si)-containing gas and hydrogen (H2)-containing gas. In this method, the nanocrystal silicon layer can be directly deposited on a glass substrate using plasma vapor deposition without performing a post-processing process so that the fabrication of a nonvolatile memory device can be simplified, thereby reducing fabrication cost.
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