Invention Grant
- Patent Title: Wiring, display device and method of manufacturing the same
- Patent Title (中): 接线,显示装置及其制造方法
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Application No.: US12614246Application Date: 2009-11-06
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Publication No.: US08110748B2Publication Date: 2012-02-07
- Inventor: Hiroki Nakamura
- Applicant: Hiroki Nakamura
- Applicant Address: JP Fukaya-shi
- Assignee: Toshiba Mobile Display Co., Ltd.
- Current Assignee: Toshiba Mobile Display Co., Ltd.
- Current Assignee Address: JP Fukaya-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2003-078113 20030320; JP2004-065613 20040309
- Main IPC: H05K1/09
- IPC: H05K1/09

Abstract:
The present invention provides a wiring, a display device, and a method of manufacturing the same. A first metal diffusion-preventing layer is formed on a substrate or on a circuit element formed on the substrate. Then, a metal wiring layer is selectively formed on the first metal diffusion-preventing layer by an electroless metal plating method or a metal electroplating method. Further, the undesired portion of the first metal diffusion-preventing layer is removed. Finally, a second metal diffusion-preventing layer is formed selectively by an electroless metal plating method in a manner to cover the metal wiring layer or both a seed layer and the metal wiring layer.
Public/Granted literature
- US20100044085A1 WIRING, DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2010-02-25
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