Invention Grant
- Patent Title: Circuit board assembly
- Patent Title (中): 电路板组装
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Application No.: US12081099Application Date: 2008-04-10
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Publication No.: US08110753B2Publication Date: 2012-02-07
- Inventor: Wei-Cheng Chen , Cheng-Chao Liao
- Applicant: Wei-Cheng Chen , Cheng-Chao Liao
- Applicant Address: TW Nan-Tou Hsien
- Assignee: Universal Scientific Industrial Co., Ltd.
- Current Assignee: Universal Scientific Industrial Co., Ltd.
- Current Assignee Address: TW Nan-Tou Hsien
- Agency: Morgan, Lewis & Bockius LLP
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H01R13/58

Abstract:
A circuit board assembly includes: a circuit board having opposite first and second surfaces and formed with a first through-hole defined by a hole-defining wall that extends between and that terminates at the first and second surfaces and that cooperates with the first and second surfaces to define first and second turns, respectively, the circuit board further having an abutting wall that extends between and that terminates at the first and second surfaces and that cooperates with the second surface to define a third turn; and an electric wire having a fixed end that is soldered to the circuit board, extending through the first through-hole, and passing over the first, second and third turns of the circuit board so as to form an inflection region between the first and second turns.
Public/Granted literature
- US20090255721A1 Circuit board assembly Public/Granted day:2009-10-15
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