Invention Grant
- Patent Title: Key structure
- Patent Title (中): 关键结构
-
Application No.: US12473229Application Date: 2009-05-27
-
Publication No.: US08110764B2Publication Date: 2012-02-07
- Inventor: Chien-Shih Hsu , Liang-Ta Yeh
- Applicant: Chien-Shih Hsu , Liang-Ta Yeh
- Applicant Address: TW Taoyuan
- Assignee: Darfon Electronics Corp.
- Current Assignee: Darfon Electronics Corp.
- Current Assignee Address: TW Taoyuan
- Priority: TW97120433A 20080602
- Main IPC: H01H13/70
- IPC: H01H13/70

Abstract:
A key structure is provided, including a substrate, a key cap, a first link, and a second link pivotally connected to the first link. The first and second links movably connect the key cap with the base. The key cap comprises a first surface and a guiding portion extended along a first direction, wherein the guiding portion has a second surface. The first link is made of metal and has a sliding end forming a first curved portion and a second curved portion. The first and second curved portions are respectively adjacent to the first and second surfaces and slidable along the guiding portion.
Public/Granted literature
- US20090294268A1 KEY STRUCTURE Public/Granted day:2009-12-03
Information query