Invention Grant
- Patent Title: Hair crimper (local heating)
- Patent Title (中): 卷发器（局部加热）
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Application No.: US12169302Application Date: 2008-07-08
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Publication No.: US08110778B2Publication Date: 2012-02-07
- Inventor: Lik Man Wong , Tak Keung Cheung
- Applicant: Lik Man Wong , Tak Keung Cheung
- Applicant Address: CN Kowloon, Hong Kong
- Assignee: Dickson Industrial Co., Ltd.
- Current Assignee: Dickson Industrial Co., Ltd.
- Current Assignee Address: CN Kowloon, Hong Kong
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: HK07107416.4 20070710
- Main IPC: A45D2/40
- IPC: A45D2/40 ; A45D1/04
Abstract:
A hair crimper comprising a pair of complementary hair crimping surfaces which are configured for hair crimping by application of heat and pressure to hair when cooperatively engaged, wherein each one of said complementary hair crimping surfaces comprises a corrugated hair styling surface which defines a transversal hair shaping profile, characterized in that, said complementary hair crimping surfaces are configured to cooperatively apply heat at predetermined intervals along said transversal hair shaping profile.
Public/Granted literature
- US20090014024A1 HAIR CRIMPER (LOCAL HEATING) Public/Granted day:2009-01-15
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