Invention Grant
- Patent Title: Diamond semiconductor devices and associated methods
- Patent Title (中): 金刚石半导体器件及相关方法
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Application No.: US11809719Application Date: 2007-05-31
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Publication No.: US08110846B2Publication Date: 2012-02-07
- Inventor: Chien-Min Sung
- Applicant: Chien-Min Sung
- Agency: Thorpe North & Western LLP
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
Semiconductor devices and methods for making such devices are provided. One such method may include forming a transparent diamond layer having a SiC layer coupled thereto, where the SiC layer has a crystal structure that is substantially epitaxially matched to the transparent diamond layer, forming epitaxially a plurality of semiconductor layers on the SiC layer, and coupling a diamond substrate to at least one of the plurality of semiconductor layers such that the diamond support is oriented parallel to the transparent diamond layer. In one aspect such a method may further include electrically coupling at least one of a p-type electrode or an n-type electrode to at least one of the plurality of semiconductor layers.
Public/Granted literature
- US20110068350A1 Diamond semiconductor devices and associated methods Public/Granted day:2011-03-24
Information query
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