Invention Grant
- Patent Title: Edge termination for high voltage semiconductor device
- Patent Title (中): 高压半导体器件的边缘端接
-
Application No.: US12206954Application Date: 2008-09-09
-
Publication No.: US08110888B2Publication Date: 2012-02-07
- Inventor: Jinshu Zhang , Dumitru Sdrulla , Dah Wen Tsang
- Applicant: Jinshu Zhang , Dumitru Sdrulla , Dah Wen Tsang
- Applicant Address: US OR Bend
- Assignee: Microsemi Corporation
- Current Assignee: Microsemi Corporation
- Current Assignee Address: US OR Bend
- Agency: Marger Johnson & McCollom, P.C.
- Main IPC: H01L23/58
- IPC: H01L23/58 ; H01L21/765

Abstract:
High voltage semiconductor devices with high-voltage termination structures are constructed on lightly doped substrates. Lightly doped p-type substrates are particularly prone to depletion and inversion from positive charges, degrading the ability of associated termination structures to block high voltages. To improve the efficiency and stability of termination structures, second termination regions of the same dopant type as the substrate, more heavily doped than the substrate but more lightly doped than first termination regions, are positioned adjoining the first termination regions. The second termination regions raise the field threshold voltage where the surface is vulnerable and render the termination structure substantially insensitive to positive charges at the surface. The use of higher dopant concentration in the gap region without causing premature avalanche is facilitated by only creating second termination regions for regions lacking field plate protection.
Public/Granted literature
- US20090072340A1 EDGE TERMINATION FOR HIGH VOLTAGE SEMICONDUCTOR DEVICE Public/Granted day:2009-03-19
Information query
IPC分类: