Invention Grant
- Patent Title: Chip package and manufacturing method thereof
- Patent Title (中): 芯片封装及其制造方法
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Application No.: US12388761Application Date: 2009-02-19
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Publication No.: US08110902B2Publication Date: 2012-02-07
- Inventor: Younghyo Eun , Dukman Kim
- Applicant: Younghyo Eun , Dukman Kim
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Cooley LLP
- Main IPC: H01L23/552
- IPC: H01L23/552
Abstract:
A chip package including at least a shielding layer for better electromagnetic interferences shielding is provided. The shielding layer disposed over the top surface of the laminate substrate can protect the chip package from the underneath EMI radiation. The chip package may further include another shielding layer over the molding compound of the chip package.
Public/Granted literature
- US20100207258A1 CHIP PACKAGE AND MANUFACTURING METHOD THEREOF Public/Granted day:2010-08-19
Information query
IPC分类:
