Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US12183649Application Date: 2008-07-31
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Publication No.: US08110912B2Publication Date: 2012-02-07
- Inventor: Manfred Mengel , Joachim Mahler
- Applicant: Manfred Mengel , Joachim Mahler
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/495
Abstract:
A method of manufacturing a semiconductor device includes providing a foil formed of an insulating material, where the foil includes at least one electrically conducting element, providing a chip having contact elements on a first face of the chip, and applying the foil over the contact elements of the chip.
Public/Granted literature
- US20100025829A1 SEMICONDUCTOR DEVICE Public/Granted day:2010-02-04
Information query
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