Invention Grant
- Patent Title: Flexible substrate for a semiconductor package, method of manufacturing the same, and semiconductor package including flexible substrate
- Patent Title (中): 用于半导体封装的柔性衬底，其制造方法以及包括柔性衬底的半导体封装
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Application No.: US10864870Application Date: 2004-06-10
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Publication No.: US08110918B2Publication Date: 2012-02-07
- Inventor: Kyoung-sei Choi
- Applicant: Kyoung-sei Choi
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2003-0037859 20030612
- Main IPC: H01L23/12
- IPC: H01L23/12
Abstract:
A flexible substrate used in a semiconductor package, a method of manufacturing the same, and a semiconductor package including the flexible substrate. A circuit pattern forming region is formed in an insulating substrate with a dented shape and a circuit pattern formed of a metallic material is formed in the circuit pattern forming region.
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