Invention Grant
US08110930B2 Die backside metallization and surface activated bonding for stacked die packages
有权
用于堆叠模具封装的背面金属化和表面活化粘合
- Patent Title: Die backside metallization and surface activated bonding for stacked die packages
- Patent Title (中): 用于堆叠模具封装的背面金属化和表面活化粘合
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Application No.: US11820454Application Date: 2007-06-19
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Publication No.: US08110930B2Publication Date: 2012-02-07
- Inventor: Shanggar Periaman , Kooi Chi Ooi , Yen Hsiang Chew , Bok Eng Cheah
- Applicant: Shanggar Periaman , Kooi Chi Ooi , Yen Hsiang Chew , Bok Eng Cheah
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Caven & Aghevli LLC
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
Methods and apparatus to provide die backside metallization and/or surface activated bonding for stacked die packages are described. In one embodiment, an active metal layer of a first die may be coupled to an active metal layer of a second die through silicon vias and/or a die backside metallization layer of the second die. Other embodiments are also described.
Public/Granted literature
- US20080315421A1 Die backside metallization and surface activated bonding for stacked die packages Public/Granted day:2008-12-25
Information query
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