In one embodiment of the present invention, a semiconductor circuit including an amplifier disposed on a semiconductor substrate is disclosed. A first bond wire coupled to an input of the amplifier, a second bond wire coupled to an output of the amplifier, and a third bond wire coupled in series with the first bond wire. A third bond wire is disposed on the semiconductor substrate so that a mutual inductance between the second bond wire and the third bond wire at least partially cancels a mutual inductance between the first bond wire and the second bond wire.