Invention Grant
- Patent Title: Over-current protection device and manufacturing method thereof
- Patent Title (中): 过流保护装置及其制造方法
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Application No.: US12469504Application Date: 2009-05-20
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Publication No.: US08111126B2Publication Date: 2012-02-07
- Inventor: Wen Chin Li , Hui Ming Feng
- Applicant: Wen Chin Li , Hui Ming Feng
- Applicant Address: TW Miaoli
- Assignee: Inpaq Technology Co., Ltd.
- Current Assignee: Inpaq Technology Co., Ltd.
- Current Assignee Address: TW Miaoli
- Agency: WPAT, P.C.
- Agent Anthony King
- Priority: TW98101467A 20090116
- Main IPC: H01C7/10
- IPC: H01C7/10

Abstract:
An over-current protection device comprises a PTC material layer, a first electrode layer, a second electrode layer, a first side electrode and a second side electrode. The PTC material layer is sandwiched between the first electrode layer and the second electrode layer. The first side electrode and the second side electrode are respectively disposed on two opposite side surfaces of the PTC material layer, and are respectively connected to the first electrode layer and the second electrode layer. Furthermore, the first side electrode and the second side electrode are respectively extended to four surfaces adjacent and perpendicular to the two side surfaces.
Public/Granted literature
- US20100182121A1 OVER-CURRENT PROTECTION DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2010-07-22
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