Invention Grant
- Patent Title: Multi-structure thermally trimmable resistors
- Patent Title (中): 多结构热可微调电阻
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Application No.: US12524516Application Date: 2008-02-06
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Publication No.: US08111128B2Publication Date: 2012-02-07
- Inventor: Oleg Grudin , Salman Saed , Tommy Tsang , Bowei Zhang , Leslie M. Landsberger , L. Richard Williston
- Applicant: Oleg Grudin , Salman Saed , Tommy Tsang , Bowei Zhang , Leslie M. Landsberger , L. Richard Williston
- Applicant Address: DE Puchheim
- Assignee: Sensortechnics GmbH
- Current Assignee: Sensortechnics GmbH
- Current Assignee Address: DE Puchheim
- Agency: Norton Rose OR, LLP
- International Application: PCT/CA2008/000228 WO 20080206
- International Announcement: WO2008/095290 WO 20080814
- Main IPC: H01C3/04
- IPC: H01C3/04

Abstract:
A method for arranging a plurality of thermally isolated microstructures over at least one cavity, each of the microstructures housing at least part of a thermally-trimmable resistor, the thermally-trimmable resistor having at least a functional resistor, the method comprising: providing pairs of facing microstructures; grouping together sets of pairs of facing microstructures, each of the sets having at least one pair of facing microstructures; and arranging microstructures within a given set to have each microstructure exposed to heat from a same number of facing, side, and diagonal neighbors of microstructures from a same resistor.
Public/Granted literature
- US20100073121A1 MULTI-STRUCTURE THERMALLY TRIMMABLE RESISTORS Public/Granted day:2010-03-25
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