Invention Grant
- Patent Title: Thermal head, printer, and manufacturing method for thermal head
- Patent Title (中): 热敏头,打印机和热头制造方法
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Application No.: US12586989Application Date: 2009-09-30
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Publication No.: US08111273B2Publication Date: 2012-02-07
- Inventor: Toshimitsu Morooka , Keitaro Koroishi , Yoshinori Sato , Noriyoshi Shoji , Norimitsu Sanbongi
- Applicant: Toshimitsu Morooka , Keitaro Koroishi , Yoshinori Sato , Noriyoshi Shoji , Norimitsu Sanbongi
- Applicant Address: JP
- Assignee: Seiko Instruments Inc.
- Current Assignee: Seiko Instruments Inc.
- Current Assignee Address: JP
- Agency: Adams & Wilks
- Main IPC: B41J2/335
- IPC: B41J2/335

Abstract:
To achieve improvements in heating efficiency and strength against external load, provided is a thermal head (1), comprising: a supporting substrate (3) having a surface in which a concave portion (2) is formed; a heat storage layer (5) bonded onto the surface of the supporting substrate (3); a heating resistor provided in a region, which is opposed to the concave portion (2) of the supporting substrate (3), on the heat storage layer (5); and a protruding portion (2A), which is provided inside a hollow portion formed between the supporting substrate (3) and the heat storage layer (5) by the concave portion (2), and comes into contact with the heat storage layer (5) and limits deflection of the heat storage layer (5) when the heating resistor is pressurized by predetermined load or more.
Public/Granted literature
- US20110074907A1 Thermal head, printer, and manufacturing method for thermal head Public/Granted day:2011-03-31
Information query
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