Invention Grant
- Patent Title: Semiconductor light-emitting device and fabrication method thereof
- Patent Title (中): 半导体发光器件及其制造方法
-
Application No.: US13005710Application Date: 2011-01-13
-
Publication No.: US08111350B2Publication Date: 2012-02-07
- Inventor: Jiro Higashino , Ji-Hao Liang , Takako Chinone , Yasuyuki Shibata
- Applicant: Jiro Higashino , Ji-Hao Liang , Takako Chinone , Yasuyuki Shibata
- Applicant Address: JP Tokyo
- Assignee: Stanley Electric Co., Ltd.
- Current Assignee: Stanley Electric Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz, Goodman & Chick, PC
- Priority: JP2010-007154 20100115
- Main IPC: G02F1/1335
- IPC: G02F1/1335

Abstract:
A plurality of protrusions is formed on the C-plane substrate with a corundum structure. A base film made of a III-V compound semiconductor including Ga and N is formed on the surface of the substrate. The surface of the base film is flatter than the surface of the substrate. A light emitting structure including Ga and N is disposed on the base film. The protrusions are regularly arranged in a first direction that is tilted by less than 15 degrees with respect to the a-axis of the base film and in a second direction that is orthogonal to the first direction. Each protrusion has two first parallel sides tilted by less than 15 degrees relative to an m-axis and two second parallel sides tilted by less than 15 degrees relative to the a-axis. An interval between the two second sides is wider than an interval between the two first sides.
Public/Granted literature
- US20110175105A1 SEMICONDUCTOR LIGHT-EMITTING DEVICE AND FABRICATION METHOD THEREOF Public/Granted day:2011-07-21
Information query
IPC分类: