Invention Grant
US08111374B2 Analysis method, exposure method, and device manufacturing method 有权
分析方法,曝光方法和装置制造方法

Analysis method, exposure method, and device manufacturing method
Abstract:
An analysis method includes a developing process (SA60), which develops the substrate, a first measuring process (SA50), which measures the abnormalities of the pre-development substrate, a second measuring process (SA70), which measures the abnormalities of the post-development substrate, and an analyzing process (SA80), which analyzes the exposure defects of a substrate exposed via a liquid based on the measurements results of the first measuring process (SA50) and the measurement results of the second measuring process (SA70).
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