Invention Grant
- Patent Title: Feedforward/feedback litho process control of stress and overlay
- Patent Title (中): 前馈/反馈光刻过程控制应力和覆盖
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Application No.: US12130699Application Date: 2008-05-30
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Publication No.: US08111376B2Publication Date: 2012-02-07
- Inventor: Michael Adel , John Fielden , Amir Widmann , John Robinson , Dongsub Choi
- Applicant: Michael Adel , John Fielden , Amir Widmann , John Robinson , Dongsub Choi
- Applicant Address: US CA San Jose
- Assignee: KLA-TENCOR Corporation
- Current Assignee: KLA-TENCOR Corporation
- Current Assignee Address: US CA San Jose
- Agency: JDI Patent
- Agent Joshua D. Isenberg
- Main IPC: G03B27/42
- IPC: G03B27/42
Abstract:
A method and apparatus for process control in a lithographic process are described. Metrology may be performed on a substrate either before or after performing a lithographic patterning process on the substrate. One or more correctables to the lithographic patterning process may be generated based on the metrology. The lithographic patterning process performed on the substrate (or a subsequent substrate) may be adjusted with the correctables.
Public/Granted literature
- US20080316442A1 FEEDFORWARD/FEEDBACK LITHO PROCESS CONTROL OF STRESS AND OVERLAY Public/Granted day:2008-12-25
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