Invention Grant
US08111487B2 Electromagnetic heads, flexures, gimbals and actuators formed on and from a wafer substrate
失效
在晶片基板上形成的电磁头,弯曲部,万向节和致动器
- Patent Title: Electromagnetic heads, flexures, gimbals and actuators formed on and from a wafer substrate
- Patent Title (中): 在晶片基板上形成的电磁头,弯曲部,万向节和致动器
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Application No.: US13074762Application Date: 2011-03-29
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Publication No.: US08111487B2Publication Date: 2012-02-07
- Inventor: Mark A. Lauer
- Applicant: Mark A. Lauer
- Main IPC: G11B5/56
- IPC: G11B5/56 ; G11B5/48 ; G11B21/16

Abstract:
Devices for reading or writing electromagnetic information include a wafer substrate piece disposed between an electromagnetic transducer and an electrostrictive or piezoelectric actuator. The substrate piece is shaped as a rigid body adjoining the transducer and as a flexible element connecting the body and the actuator. To fabricate, at least one electrostrictive layer and many transducers are formed on opposite sides of a wafer that is then cut into rows containing plural transducers. The rows are processed from directions generally normal to the wafer surface upon which the transducers were formed, by removing material to form a head, flexures and a media-facing surface on the head. Conductive leads are formed on a back surface of flexures connecting the transducer with drive electronics. The flexures are aligned with forces arising from interaction with the media surface and from seeking various tracks, reducing torque and dynamic instabilities and increasing actuator access time.
Public/Granted literature
- US20110176242A1 Electromagnetic Heads, Flexures, Gimbals And Actuators Formed On And From A Wafer Substrate Public/Granted day:2011-07-21
Information query
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