Invention Grant
US08111517B2 Heat sink assembly, portable electronic device using same and wireless modem using the heat sink assembly
有权
散热器组件,使用相同的便携式电子设备和使用散热器组件的无线调制解调器
- Patent Title: Heat sink assembly, portable electronic device using same and wireless modem using the heat sink assembly
- Patent Title (中): 散热器组件,使用相同的便携式电子设备和使用散热器组件的无线调制解调器
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Application No.: US12791053Application Date: 2010-06-01
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Publication No.: US08111517B2Publication Date: 2012-02-07
- Inventor: Cheng-Lung Chang
- Applicant: Cheng-Lung Chang
- Applicant Address: TW Tu-Cheng, New Taipei
- Assignee: Chi Mei Communication Systems, Inc.
- Current Assignee: Chi Mei Communication Systems, Inc.
- Current Assignee Address: TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: TW98140762 20091130
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A heat sink assembly, a portable electronic device using the same and a wireless modem using the heat sink assembly are disclosed. The heat sink assembly assembled within the portable electronic for dissipating the heat source generated within the portable electronic device to the outside. The heat sink assembly includes a frame, a cover and an absorbing sheet. The frame includes a through opening formed and surrounded thereby. The cover foldably or bendably extends outwardly from one side of the frame and is configured to be alternatively accommodated within the opening of the frame for covering the opening or forming an angle relative to the frame. The absorbing sheet is fixedly covered on the other side of the frame opposite to the cover.
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