Invention Grant
- Patent Title: Semiconductor module
- Patent Title (中): 半导体模块
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Application No.: US12344817Application Date: 2008-12-29
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Publication No.: US08111520B2Publication Date: 2012-02-07
- Inventor: Hyun-Soo Chung , Dong-Ho Lee , Dong-Han Kim , Seong-Deok Hwang , Ki-Hyuk Kim
- Applicant: Hyun-Soo Chung , Dong-Ho Lee , Dong-Han Kim , Seong-Deok Hwang , Ki-Hyuk Kim
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG Electronics Co., Ltd.
- Current Assignee: SAMSUNG Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Stanzione & Kim, LLP
- Priority: KR10-2008-0000143 20080102
- Main IPC: H05K1/18
- IPC: H05K1/18
Abstract:
A semiconductor module can include a printed circuit board (PCB) and a semiconductor package inserted into an inner space of the PCB. The semiconductor package may be electrically connected to the PCB. The PCB may thus surround the semiconductor package so that cracks may not be generated in the outer terminals.
Public/Granted literature
- US20090168382A1 SEMICONDUCTOR MODULE Public/Granted day:2009-07-02
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