Invention Grant
- Patent Title: Semiconductor laser and manufacturing process thereof
- Patent Title (中): 半导体激光器及其制造工艺
-
Application No.: US12618277Application Date: 2009-11-13
-
Publication No.: US08111728B2Publication Date: 2012-02-07
- Inventor: Masahide Kobayashi
- Applicant: Masahide Kobayashi
- Applicant Address: JP Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Sughrue Mion, PLLC
- Priority: JP2008-293777 20081117
- Main IPC: H01S5/00
- IPC: H01S5/00

Abstract:
A semiconductor laser has a semiconductor substrate, a lower cladding layer formed on the semiconductor substrate, an active layer disposed above the lower cladding layer, a first upper cladding layer disposed above the active layer, a second upper cladding layer disposed above the first upper cladding layer and having a mesa structure, a high-order mode filter layer formed on both side faces of the second upper cladding layer, continuously extending from the both side faces onto at least a part of a side region on both sides of the second upper cladding layer and having a band gap not exceeding a band gap of the active layer, and a block layer formed on the high-order mode filter layer and on a side region on both sides of the second upper cladding layer and including a layer having a band gap greater than a band gap of the active layer.
Public/Granted literature
- US20100124245A1 SEMICONDUCTOR LASER AND MANUFACTURING PROCESS THEREOF Public/Granted day:2010-05-20
Information query