Invention Grant
- Patent Title: Supra-aural headphone noise reducing
- Patent Title (中): 超听觉耳机降噪
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Application No.: US12576699Application Date: 2009-10-09
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Publication No.: US08111858B2Publication Date: 2012-02-07
- Inventor: Roman Sapiejewski
- Applicant: Roman Sapiejewski
- Applicant Address: US MA Framingham
- Assignee: Bose Corporation
- Current Assignee: Bose Corporation
- Current Assignee Address: US MA Framingham
- Main IPC: H04R25/00
- IPC: H04R25/00
Abstract:
An earphone for a supra-aural noise reducing headphone, with a front cavity that includes a foam portion and an open passageway. The foam portion supplements the volumetric dimension of the passageway to improve passive attenuation.
Public/Granted literature
- US20100027803A1 SUPRA-AURAL HEADPHONE NOISE REDUCING Public/Granted day:2010-02-04
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