Invention Grant
- Patent Title: Method for collecting data from semiconductor equipment
- Patent Title (中): 从半导体设备收集数据的方法
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Application No.: US10746658Application Date: 2003-12-23
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Publication No.: US08112400B2Publication Date: 2012-02-07
- Inventor: Bing Ouyang , Gurshaman S. Baweja , Donald J. Rigsby, Jr.
- Applicant: Bing Ouyang , Gurshaman S. Baweja , Donald J. Rigsby, Jr.
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Rose Alyssa Keagy; Wade J. Brady, III; Frederick J. Telecky, Jr.
- Main IPC: G06F7/00
- IPC: G06F7/00

Abstract:
A method for collecting data from semiconductor equipment includes selecting a plurality of data values to request from semiconductor equipment and assigning each of the data values to a chamber. Each chamber is associated with an engine that processes the data values in the associated chamber to detect a fault in the semiconductor equipment. The method also includes determining an order to receive the data values from the semiconductor equipment, and, after the order for the data values is determined, communicating a setup message requesting the semiconductor equipment to communicate the data values in the predetermined order. The method further includes receiving the data values from the semiconductor equipment and providing each of the received data values to the particular engine associated with the chamber of the data value.
Public/Granted literature
- US20050138075A1 Method for collecting data from semiconductor equipment Public/Granted day:2005-06-23
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