Invention Grant
US08112685B2 Serial compressed data I/O in a parallel test compression architecture
有权
并行测试压缩架构中的串行压缩数据I / O
- Patent Title: Serial compressed data I/O in a parallel test compression architecture
- Patent Title (中): 并行测试压缩架构中的串行压缩数据I / O
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Application No.: US12795326Application Date: 2010-06-07
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Publication No.: US08112685B2Publication Date: 2012-02-07
- Inventor: Lee D. Whetsel
- Applicant: Lee D. Whetsel
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Lawrence J. Bassuk; W. James Brady; Frederick J. Telecky, Jr.
- Main IPC: G01R31/28
- IPC: G01R31/28

Abstract:
The disclosure describes novel methods and apparatuses for accessing test compression architectures (TCA) in a device using either a parallel or serial access technique. The serial access technique may be controlled by a device tester or by a JTAG controller. Further the disclosure provides an approach to access the TCA of a device when the device exists in a daisy-chain arrangement with other devices, such as in a customer's system. Additional embodiments are also provided and described in the disclosure.
Public/Granted literature
- US20100318863A1 PARALLEL AND SERIAL ACCESS TO TEST COMPRESSION ARCHITECTURES Public/Granted day:2010-12-16
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