Invention Grant
US08112685B2 Serial compressed data I/O in a parallel test compression architecture 有权
并行测试压缩架构中的串行压缩数据I / O

  • Patent Title: Serial compressed data I/O in a parallel test compression architecture
  • Patent Title (中): 并行测试压缩架构中的串行压缩数据I / O
  • Application No.: US12795326
    Application Date: 2010-06-07
  • Publication No.: US08112685B2
    Publication Date: 2012-02-07
  • Inventor: Lee D. Whetsel
  • Applicant: Lee D. Whetsel
  • Applicant Address: US TX Dallas
  • Assignee: Texas Instruments Incorporated
  • Current Assignee: Texas Instruments Incorporated
  • Current Assignee Address: US TX Dallas
  • Agent Lawrence J. Bassuk; W. James Brady; Frederick J. Telecky, Jr.
  • Main IPC: G01R31/28
  • IPC: G01R31/28
Serial compressed data I/O in a parallel test compression architecture
Abstract:
The disclosure describes novel methods and apparatuses for accessing test compression architectures (TCA) in a device using either a parallel or serial access technique. The serial access technique may be controlled by a device tester or by a JTAG controller. Further the disclosure provides an approach to access the TCA of a device when the device exists in a daisy-chain arrangement with other devices, such as in a customer's system. Additional embodiments are also provided and described in the disclosure.
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