Invention Grant
- Patent Title: Adapter board and method for manufacturing same, probe card, method for inspecting semiconductor wafer, and method for manufacturing semiconductor device
- Patent Title (中): 适配器板及其制造方法，探针卡，半导体晶片检查方法以及半导体器件的制造方法
-
Application No.: US12929057Application Date: 2010-12-27
-
Publication No.: US08114687B2Publication Date: 2012-02-14
- Inventor: Osamu Mizoguchi
- Applicant: Osamu Mizoguchi
- Applicant Address: JP Kawasaki-shi, Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kawasaki-shi, Kanagawa
- Agency: McGinn Intellectual Property Law Group, PLLC
- Priority: JP2008-180601 20080710
- Main IPC: G01R31/26
- IPC: G01R31/26 ; H01L21/66
Abstract:
A method of manufacturing a semiconductor device includes preparing two package substrates, electrically coupling a semiconductor wafer to a measuring apparatus, inspecting the wafer, dicing the semiconductor wafer into semiconductor elements and packaging the semiconductor element over the prepared package substrates.
Public/Granted literature
Information query
