Invention Grant
- Patent Title: Circuit board and method for jointing circuit board
- Patent Title (中): 电路板及接线方法
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Application No.: US12427991Application Date: 2009-04-22
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Publication No.: US08115109B2Publication Date: 2012-02-14
- Inventor: Masayoshi Koyama , Norihito Tsukahara , Susumu Matsuoka
- Applicant: Masayoshi Koyama , Norihito Tsukahara , Susumu Matsuoka
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Steptoe & Johnson LLP
- Priority: JP2008-113553 20080424
- Main IPC: H05K1/11
- IPC: H05K1/11

Abstract:
A circuit board in which end faces (36a) of wires are located in positions withdrawn from the end in a joint region of a first board (31a), end faces (36b) of wires are located in positions withdrawn from the end in a joint region of a second board (31b), a gap (W) between the end faces (36a) of the wires of the first board (31a) and the end faces (36b) of the wires of the second board (31b) is filled with a conductor (16A), and the first board (31a) and the second board (31b) are jointed by means of a resin.
Public/Granted literature
- US20090266592A1 CIRCUIT BOARD AND METHOD FOR JOINTING CIRCUIT BOARD Public/Granted day:2009-10-29
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