Invention Grant
- Patent Title: Circuit board and method of manufacturing same
- Patent Title (中): 电路板及其制造方法
-
Application No.: US12035819Application Date: 2008-02-22
-
Publication No.: US08116092B2Publication Date: 2012-02-14
- Inventor: Yuji Ishida , Hideto Takekawa , Masato Harikae , Kazutaka Terada
- Applicant: Yuji Ishida , Hideto Takekawa , Masato Harikae , Kazutaka Terada
- Applicant Address: JP Kyoto
- Assignee: Kyocera Corporation
- Current Assignee: Kyocera Corporation
- Current Assignee Address: JP Kyoto
- Agency: Morrison & Foerster LLP
- Priority: JP2007-041755 20070222
- Main IPC: H05K7/06
- IPC: H05K7/06 ; H05K3/32

Abstract:
A circuit board includes a substrate, a conductive pattern arranged on the substrate that includes an interconnecting circuit. The circuit board also includes a plurality of land pads having a pair of first land pads on which no electronic components are mounted and electrically connected to each other through the interconnecting circuit. The circuit board further includes an insulating layer on the substrate. The insulating layer has first openings that allow the pair of the first land pads to be exposed through the insulating layer.
Public/Granted literature
- US20080212300A1 CIRCUIT BOARD AND METHOD OF MANUFACTURING SAME Public/Granted day:2008-09-04
Information query