Invention Grant
- Patent Title: Headset
- Patent Title (中): 耳机
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Application No.: US12444060Application Date: 2007-06-22
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Publication No.: US08116501B2Publication Date: 2012-02-14
- Inventor: Daisuke Kusuda , Yoshito Fujimoto , Hiroyoshi Shinozuka
- Applicant: Daisuke Kusuda , Yoshito Fujimoto , Hiroyoshi Shinozuka
- Applicant Address: JP Osaka
- Assignee: Hosiden Corporation
- Current Assignee: Hosiden Corporation
- Current Assignee Address: JP Osaka
- Agency: The Webb Law Firm
- Priority: JP2006-272032 20061003
- International Application: PCT/JP2007/062567 WO 20070622
- International Announcement: WO2008/041396 WO 20080410
- Main IPC: H04R25/00
- IPC: H04R25/00

Abstract:
A headset comprising a body portion including a microphone section, a receiver section, a battery section and a wireless communication section, all provided in a case having a substantially flat surface, and a projecting portion projecting from the substantially flat surface, is arranged such that the ear pad of the receiver section attached to the tip of the projecting portion is inserted into the external auditory meatus. A portion coming into resilient contact with the inner wall of the cavity of the concha on the inside of a tragus and an antitragus is provided at the projecting portion closer to the body portion side than the ear pad, wherein the ear pad is of an earplug type deformable elastically to ensure a close contact with the inner wall of the external auditory meatus.
Public/Granted literature
- US20100098285A1 Headset Public/Granted day:2010-04-22
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