Invention Grant
- Patent Title: Injection mold
- Patent Title (中): 注塑模具
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Application No.: US12787123Application Date: 2010-05-25
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Publication No.: US08118580B2Publication Date: 2012-02-21
- Inventor: Xiaoping Wu , Xuxu Zhao , Shih-Hsiung Ho
- Applicant: Xiaoping Wu , Xuxu Zhao , Shih-Hsiung Ho
- Applicant Address: TW Taipei
- Assignee: Cheng Uei Precision Industry Co., Ltd.
- Current Assignee: Cheng Uei Precision Industry Co., Ltd.
- Current Assignee Address: TW Taipei
- Agency: WPAT, P.C.
- Agent Anthony King
- Main IPC: B29C45/14
- IPC: B29C45/14

Abstract:
An injection mold has a lower mold half having a chamber at a top thereof. A holding plate has a top within the chamber formed with a plurality of holding slots. The holding slots extend frontward and rearward. A positioning plate is attached to a front surface of the holding plate, an upper portion of which within the chamber has a plurality of positioning holes at a front surface thereof. A fixing plate disposed rearward of the holding plate has a plurality of through holes at a top thereof. A plurality of first positioning rods is mounted to the installing holes, each of which defines a free end extending beyond the top of the fixing plate. A free end of each of a plurality of second positioning rods is capable of inserting into the positioning hole. An upper mold half is engaged with the lower mold half.
Public/Granted literature
- US20110293768A1 Injection Mold Public/Granted day:2011-12-01
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