Invention Grant
US08118624B2 Lead plate with a joint portion having a surface area smaller than that of its mounting portion
有权
铅板，其接合部分的表面积小于其安装部分的表面积
- Patent Title: Lead plate with a joint portion having a surface area smaller than that of its mounting portion
- Patent Title (中): 铅板，其接合部分的表面积小于其安装部分的表面积
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Application No.: US12923563Application Date: 2010-09-28
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Publication No.: US08118624B2Publication Date: 2012-02-21
- Inventor: Bong-Young Kim , Young-Ho Kim
- Applicant: Bong-Young Kim , Young-Ho Kim
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung SDI Co., Ltd.
- Current Assignee: Samsung SDI Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2009-0126076 20091217
- Main IPC: H01R9/24
- IPC: H01R9/24
Abstract:
A lead plate for connecting a printed circuit board (PCB) of a secondary battery to an bare cell includes a mounting portion connected to the PCB, a joint portion connected to the bare cell, a surface area of the joint portion facing the bare cell being smaller than a surface area of the mounting portion facing the PCB, and a step portion connecting the mounting portion and the joint portion to each other.
Public/Granted literature
- US20110151730A1 Lead plate and protection circuit module having the same Public/Granted day:2011-06-23
Information query
