Invention Grant
- Patent Title: Dicing die-bonding film
- Patent Title (中): 切片芯片接合薄膜
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Application No.: US12533272Application Date: 2009-07-31
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Publication No.: US08119236B2Publication Date: 2012-02-21
- Inventor: Katsuhiko Kamiya , Takeshi Matsumura , Shuuhei Murata , Hironao Ootake
- Applicant: Katsuhiko Kamiya , Takeshi Matsumura , Shuuhei Murata , Hironao Ootake
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Knobbe, Martens, Olson & Bear LLP
- Priority: JP2008-200983 20080804
- Main IPC: B32B7/12
- IPC: B32B7/12 ; B32B15/04

Abstract:
A dicing die-bonding film having a pressure-sensitive adhesive layer on a base and a die-bonding film on the pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer comprising an acrylic polymer comprising acrylic ester A represented by CH2═CHCOOR1 (where R1 is an alkyl group having 6-10 carbon atoms), acrylic ester B represented by CH2═CHCOOR2 (where R2 is an alkyl group having 11 carbon atoms or more), a hydroxyl group-containing monomer, and an isocyanate compound having a radical reactive carbon-carbon double bond where the ratios of components are 40-10 mol % of the acrylic ester B with respect to 60-90 mol % of the acrylic ester A, 10-30 mol % hydroxyl group-containing monomer with respect to 100 mol % of the total of the acrylic ester A and the acrylic ester B, and 70-90 mol % isocyanate compound with respect to 100 mol % of the monomer containing a hydroxl group.
Public/Granted literature
- US20100029060A1 DICING DIE-BONDING FILM Public/Granted day:2010-02-04
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