An image sensor includes an insulating interlayer including a metal line on a semiconductor substrate, a photodiode pattern provided on the insulating interlayer to be connected to the metal line, the photodiode pattern separated per unit pixel by a gap area, a device isolation insulating layer provided on the insulating interlayer including the photodiode pattern and the gap area, a contact hole provided to the device isolation insulating layer to expose the photodiode pattern and a neighbor photodiode pattern, and a contact plug provided to the contact hole to be connected to a plurality of the photodiode patterns.