The aim the disclosed process is to ensure maximum precision both at the level of the manufacturing of an electronic assembly from a chip with small dimensions as well as the level of the placement of such an assembly on an insulating substrate. This aim is achieved by a placement process on a substrate, of at least one electronic assembly comprising a chip having at least one electric contact on one of its faces, said contact being intended to be electrically connected to a conductive track segment. The electronic assembly is built on a holding device which seizes and holds at least one conductive track segment previously formed and a chip. A placement device places this electronic assembly thus built at a predetermined position relative to the substrate and embeds or inserts said electronic assembly into the substrate.